PC/ABS CHIMEI PC‑540A

PC/ABS CHIMEI PC‑540A

PC/ABS CHIMEI PC‑540A is a halogen‑free flame‑retardant alloy material with good heat resistance. It combines the strength and heat resistance of polycarbonate (PC) with the processing flowability of ABS.

Main Applications

Electrical‑Electronic: set‑top boxes, projectors, display front bezels, 3C digital products, transformers, game consoles, small tablet computers, network‑communication products, etc.

Computers & Accessories: high‑tech products such as computer housings and attachments.

Physical Properties

Property Category Test Item Test Standard Data Unit
Physical Properties Density / Specific Gravity ASTM D792, ISO 1183 1.18 g/cm³
  Melt Flow Rate 260°C / 2.16 kg, ASTM D1238 22 g/10 min
  Mold Shrinkage (Flow Direction) ASTM D955 0.40‑0.60 %
  Water Absorption (23°C, 24 hr) ASTM D570 0.40 %
Mechanical Properties Tensile Strength (Yield, 23°C) ASTM D638 58.8 MPa
  Elongation at Break (23°C) ASTM D638 100 %
  Flexural Modulus (23°C) ASTM D790 2460 MPa
  Flexural Strength (23°C) ASTM D790 89.2 MPa
  Izod Notched Impact Strength (23°C, 3.18 mm) ASTM D256 640 J/m
  Rockwell Hardness (R‑Scale) ASTM D785 118
Thermal Properties Heat‑Distortion Temperature (1.8 MPa, unannealed) ASTM D648 92.0 °C
  Vicat Softening Temperature ASTM D1525 107 °C
  Linear Thermal Expansion Coefficient‑Flow Direction (40‑100°C) ASTM D696 6.0E‑5‑8.0E‑5 cm/cm/°C
Flame Retardancy UL Flammability Rating (1.50 mm) UL 94 V‑0
  UL Flammability Rating (2.00 mm) UL 94 5VB

Processing Parameters

Process Parameter Unit Recommended Value / Range
Drying Treatment    
Drying Temperature °C 90.0
Drying Time h 4.0
Recommended Moisture Content % < 0.04
Injection Molding Temperature    
Rear Barrel Temperature °C 200‑220
Middle Barrel Temperature °C 230‑250
Front Barrel Temperature °C 220‑240
Nozzle Temperature °C 220‑240
Melt Temperature °C 220‑240
Mold Temperature °C 40.0‑70.0

Note: All information above is for reference only!

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